◆Label Form Specification

◆Precautions In Use

A、Soldering Conditions

1、When soldering, leave the minimum clearance between the bottom of the resin and the soldering point.

2、Maximum allowable soldering conditions are.

Solder dipping: 260 ℃max., 5 seconds max., one time.

Soldering iron: 350 ℃ max., 5 seconds max., one time.

3、Contact between molten solder and the resin must be avoided.

4、In soldering, do not put any stress on the lead frame, particularly when heated.

B、Lead frame Forming and Use

1、When forming leads ,the leads should be bent at a point at least 3mm from the base of epoxy. Lead forming should be done before soldering.

2、Do not apply any bending stress to the base of the lead. The stress to the base may damage the LEDs characteristics.

3、When mounting the LEDs onto a printed circuit board ,the holes on the circuit board should be exactly aligned with the leads of the LEDs.

4、Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible.

5、Please avoid rapid transitions in ambient temperature, especially, in high humidity environments.

◆Notes:

1、Above specification may be changed without notice. We will reserve authority on material change for above specification.

2、When using this product, please observe the absolute maximum ratings and the instructions for the specification sheets. We assume no responsibility for any damage resulting from use of the product which does not comply with the instructions included in the specification sheets.