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◆Label
Form Specification
◆Precautions
In Use
A、Soldering
Conditions
1、When soldering, leave the minimum clearance
between the bottom of the resin and the soldering point.
2、Maximum allowable soldering conditions are.
Solder dipping: 260 ℃max., 5 seconds max., one time.
Soldering
iron: 350 ℃ max., 5 seconds max., one time.
3、Contact
between molten solder and the resin must be avoided.
4、In soldering, do not put any stress on the
lead frame, particularly when heated.
B、Lead
frame Forming and Use
1、When forming leads ,the leads should be
bent at a point at least 3mm from the base of epoxy. Lead forming should be
done before soldering.
2、Do not apply any bending stress to the
base of the lead. The stress to the base may damage the LEDs
characteristics.
3、When mounting the LEDs onto a printed
circuit board ,the holes on the circuit board should be exactly
aligned with the leads of the LEDs.
4、Please avoid conditions which may cause
the LED to corrode, tarnish or discolor. This corrosion or
discoloration may cause difficulty during soldering operations. It
is recommended that the LEDs be used as soon as possible.
5、Please avoid rapid transitions in
ambient temperature, especially, in high humidity environments.
◆Notes:
1、Above specification may be changed
without notice. We will reserve authority on material change for
above specification.
2、When using this product, please observe
the absolute maximum ratings and the instructions for the specification
sheets. We assume no responsibility for any damage resulting from
use of the product which does not comply with the instructions
included in the specification sheets.
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